Backend Design & Manufacturing Services

Physical Design (PD): Optimized layouts focused on power, performance, and area (PPA)
- Gate-Level Netlist, Partitioning, Floor Planning, Placement, Static Time Analysis, Clock Tree Synthesis, Routing, Physical Verification
Layout Generation: Precise geometries delivered in GDSII and OASIS formats
Design Rule Check (DRC): Foundry-compliant verification to ensure manufacturability and yield
IP Integration: Seamless incorporation of third-party and proprietary IP blocks

Wafer-Level Testing: Electrical validation using Automated Test Equipment (ATE)
Package Design: Custom packaging solutions tailored for performance and reliability
Assembly: Die packaging via wire bonding, flip-chip, and encapsulation
Final Test: Functional and parametric testing to ensure product quality
Yield Optimization: Screening, binning, and failure analysis to maximize output
Silicon/Package Reliability Testing: Compliance with JEDEC, ISO, and customer-specific standards
Logistics Coordination: Fab-to-finish support including packaging, shipping, and tracking
Volume Production Support: Scalable test and assembly services for high-volume manufacturing