Backend Design & Manufacturing Services

Physical Design (PD): Optimized layouts focused on power, performance, and area (PPA)

• Gate-Level Netlist, Partitioning, Floor Planning, Placement, Static Time Analysis, Clock Tree Synthesis, Routing, Physical Verification

Layout Generation: Precise geometries delivered in GDSII and OASIS formats

Design Rule Check (DRC): Foundry-compliant verification to ensure manufacturability and yield

IP Integration: Seamless incorporation of third-party and proprietary IP blocks

Wafer-Level Testing: Electrical validation using Automated Test Equipment (ATE)

Package Design: Custom packaging solutions tailored for performance and reliability

Assembly: Die packaging via wire bonding, flip-chip, and encapsulation

Final Test: Functional and parametric testing to ensure product quality

Yield Optimization: Screening, binning, and failure analysis to maximize output

Silicon/Package Reliability Testing: Compliance with JEDEC, ISO, and customer-specific standards

Logistics Coordination: Fab-to-finish support including packaging, shipping, and tracking

Volume Production Support: Scalable test and assembly services for high-volume manufacturing