It's not just an MPW.
ASSEMBLY AT TSMC
Single Supplier for Entire Project
Assembled at TSMC
2 Day Assembly Cycle Time
Reduced Shipping Time & Cost
AVAILABLE PACKAGES
Technology
Body Size (mm)
Leads
CQFP
28 x 28
128
CQFP
28 x 28
128
CQFP
28 x 28
128
CQFP
27.2 x 27.2
120,144,160,208
CQFP
14 x 20
64,80,100
CQFP
14 x 20
64,80,100
CLCC
29.21 x 29.21
84
CLCC
24.12 x 24.12
68
CLCC
16.5 x 16.5
44
DIP
61 x 15.24
48
DIP
50.8 x 15.24
40
DIP
35.6 x 15.24
28
DIP
22.9 x 7.62
18
DIP
17.8 x 7.62
14
CQFP = Ceramic Quad Flat Pack
CLCC = Ceramic Leadless Chip Carrier
DIP = Dual Inline Package