©2019 BY MUSE SEMICONDUCTOR LLC. ALL RIGHTS RESERVED.

ASSEMBLY AT TSMC

Single Supplier for Entire Project

Assembled at TSMC

2 Day Assembly Cycle Time

Reduced Shipping Time & Cost

AVAILABLE PACKAGES

Technology

Body Size (mm)

Leads

CQFP

28 x 28

128

CQFP

28 x 28

128

CQFP

28 x 28

128

CQFP

27.2 x 27.2

120,144,160,208

CQFP

14 x 20

64,80,100

CQFP

14 x 20

64,80,100

CLCC

29.21 x 29.21

84

CLCC

24.12 x 24.12

68

CLCC

16.5 x 16.5

44

DIP

61 x 15.24

48

DIP

50.8 x 15.24

40

DIP

35.6 x 15.24

28

DIP

22.9 x 7.62

18

DIP

17.8 x 7.62

14

CQFP = Ceramic Quad Flat Pack

CLCC = Ceramic Leadless Chip Carrier

DIP = Dual Inline Package